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Featured Capabilities and Instruments

Non-Destructive Analysis

X-ray Analysis​
Optical Analysis

​Reliability Testing​

Temperature Humidity​

Thermal Shock​

High/ Low Temperature Chambers​

Salt Spray​

Chemical Resistance Test​
Material Characterisation

Scanning Electron Microscopy/Energy Dispersive X-ray analysis (SEM/EDX)

​X-ray fluorescence (XRF)​

Fourier Transform Infrared (FTIR) spectrometry​

Gas Chromatography – Mass Spectrometry (GCMS)

Inductively Coupled Plasma – Mass Spectrometry (ICP-MS)

Inductively Coupled Plasma – Optical Emission Spectroscopy (ICP-OES)​

Ion Chromatography (IC)​

Liquid Chromatography / Mass Spectrometry (LC/MS)​
Electrostatic Discharge (ESD) Testing

Surface and Volume Resistance

Charged Plate Monitoring

Static Decay Measurement in Humidity Chamber

Guiding Principles from ANSI/ESD S20.20

ANSI/ESD STM4.1

ANSI/ESD S6.1

ANSI/ESD STM7.1

ANSI/ESD STM9.1

ANSI/ESD SP9.2

ANSI/ESD STM11.11

ANSI/ESD STM11.12

ANSI/ESD STM11.13

ANSI/ESD STM11.31

ANSI/ESD STM12.1

ESD SP15.1

With frequent exposure to real case analysis works, our understanding in the failure is greatly enhanced.
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Our KNOWLEDGE may be the ANSWER to your problem.

Components of Failure Analysis
Non-destructive testing
Material characterisation
electrostatic discharge (esd) testing
reliability testing
Fulfilling multiple test requirements
Our failure analysis services can be done as part of the following testing services
  • IconChemical Testing
  • IconElectrical Testing
  • IconPolymer & Organic Material Characterisation
  • IconDestructive & Mechanical Testing
  • IconNon-Destructive Testing
  • IconSurface Analysis
Products that we conduct failure analysis on
  • IconElectronic components
  • IconPolymer materials
  • IconUnknown materials
  • IconPCBA
  • IconChemicals
  • IconForeign Materials
  • IconFood / Drugs
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