Surfaces are the primary contact point for environmental interactions, making them vulnerable to external damage. SETSCO’s surface analysis techniques include:

• SEM/EDX (Scanning Electron Microscopy/Energy Dispersive X-ray analysis): Examines the top micrometre of the surface, often as a preliminary step to select the appropriate surface analysis technique.
• TOF-SIMS (Time of Flight Secondary Ion Mass Spectrometry): Analyses very thin surface layers of organic compounds, offering maps and depth profiles of specific atomic and molecular masses.
• AES (Auger Electron Spectroscopy): Provides elemental analysis for the top few nanometres with sub-micrometre resolution, ideal for conductive samples. Generates elemental maps and depth profiles.
• XPS (X-ray photoelectron spectroscopy): Similar to AES but also provides chemical information. Suitable for non-conductive samples, with slightly lower spatial resolution.
• AFM (Atomic Force Microscopy): Produces high-resolution surface images, measuring surface texture and roughness at the nanometre scale.

Non-destructive testing (NDT) allows us to examine samples without permanent alteration, preserving their structure. SETSCO employs several NDT methods:

• Optical Microscopy: With digital imaging and analysis, used for dimensional measurements, archiving, and inspecting components, microstructures, defects, and contamination.
• X-RAY Scanning: Quickly views the internal structure of a sample, particularly useful for inspecting solder joints and device structures.
• Scanning Acoustic Microscopy (SAM): Uses ultrasound to detect changes in acoustic impedance, revealing internal voids or delamination.

Destructive testing provides definitive insights into material strength and failure characteristics. SETSCO’s destructive and mechanical tests include:

• Mechanical Cross-Sectioning: Exposes a sample’s internal structure through precise grinding, polishing, and mounting.
• Focused Ion Beam (FIB): Used for detailed cross-sections, TEM preparation, or circuit modification.
• Decapsulation: Chemically or laser removes materials to expose a sample’s inner structure.
• Hardness and Tensile Testing: Measures resistance to deformation and tensile strength.
• Solderability Test: Assesses the ease of creating a soldered joint, detecting potential contamination issues.
• Wire Pull and Ball Shear Tests: Tests wire bonds and solder balls to verify bonding strength.
• Transmission Electron Microscopy (TEM): Uses high-energy electrons for imaging ultra-thin samples, identifying nanometre-scale defects.

Understanding polymers and organic compounds is essential for device reliability. SETSCO offers:

• Differential Scanning Calorimetry (DSC): Measures thermal properties like glass transition temperature and phase changes.
• Thermogravimetric Analysis (TGA): Examines moisture content, residual solvents, and polymer degradation temperatures.
• FTIR (Fourier Transform Infrared) and GCMS (Gas Chromatography-Mass Spectrometry): Identifies unknown organic compounds like adhesives, coatings, and lubricants.
• Melt Flow Index: Determines the flow properties of thermoplastic polymers.