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Featured Capabilities and Instruments

Non-Destructive Analysis

X-ray Analysis​
Optical Analysis

Reliability Testing

Temperature Humidity​

Thermal Shock​

High/ Low Temperature Chambers​

Salt Spray​

Chemical Resistance Test​
Material Characterisation

Scanning Electron Microscopy/Energy Dispersive X-ray analysis (SEM/EDX)

​X-ray fluorescence (XRF)​

Fourier Transform Infrared (FTIR) spectrometry​

Gas Chromatography – Mass Spectrometry (GCMS)

Inductively Coupled Plasma – Mass Spectrometry (ICP-MS)

Inductively Coupled Plasma – Optical Emission Spectroscopy (ICP-OES)​

Ion Chromatography (IC)​

Liquid Chromatography / Mass Spectrometry (LC/MS)​
Electrostatic Discharge (ESD) Testing

Surface and Volume Resistance

Charged Plate Monitoring

Static Decay Measurement in Humidity Chamber

Guiding Principles from ANSI/ESD S20.20

ANSI/ESD STM4.1

ANSI/ESD S6.1

ANSI/ESD STM7.1

ANSI/ESD STM9.1

ANSI/ESD SP9.2

ANSI/ESD STM11.11

ANSI/ESD STM11.12

ANSI/ESD STM11.13

ANSI/ESD STM11.31

ANSI/ESD STM12.1

ESD SP15.1

With frequent exposure to real case analysis works, our understanding in the failure is greatly enhanced.

Our KNOWLEDGE may be the ANSWER to your problem.

Components of Failure Analysis
Non-destructive testing
Material characterisation
electrostatic discharge (esd) testing
reliability testing
Fulfilling multiple test requirements
Our failure analysis services can be done as part of the following testing services
  • IconChemical Testing
  • IconElectrical Testing
  • IconPolymer & Organic Material Characterisation
  • IconDestructive & Mechanical Testing
  • IconNon-Destructive Testing
  • IconSurface Analysis
Products that we conduct failure analysis on
  • IconElectronic components
  • IconPolymer materials
  • IconUnknown materials
  • IconPCBA
  • IconChemicals
  • IconForeign Materials
  • IconFood / Drugs
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